Friday, February 26, 2016

AMD Expands Low-Power, G-Series Processor Family

At Embedded World today, AMD (NASDAQ:AMD) announced its 3rd Generation AMD Embedded G-Series SoCs and the Embedded G-Series LX SoC, providing customers a broadened portfolio of performance options. The latest offerings expand developers’ ability to scale x86 platforms, starting with the entry-level AMD Embedded G-Series LX SoC, which is pin compatible to the previous generation G-Series SoC devices. Also announced today are two new, higher performing 3rd Generation AMD Embedded G-Series SoCs, codenamed “Prairie Falcon” and “Brown Falcon,” which introduce for the first time pin compatibility for G-Series processors with the higher performance AMD Embedded R-Series SoC.

The new products expand upon the low power capabilities of the award-winning AMD Embedded G-Series SoC platform, bringing scalable performance, power, and price across the CPU, GPU, multimedia, and I/O controller hardware, helping to lower development costs for AMD customers. Together, the new G-Series processors deliver immersive, graphically rich experiences across a broad range of platforms, from entry-level to mainstream gaming, digital signage, imaging, and industrial control.

“The latest AMD Embedded G-Series SoC additions offer our customers a broad range of mainstream embedded solutions, including two that are in the same package as the higher-performance R-Series,” said Scott Aylor, corporate vice president and general manager, AMD Enterprise Solutions. “The new SoCs further our commitment to provide embedded design engineers with an evolutionary path toward the highest levels of power efficient compute and graphics capabilities, and a strong value proposition for a broad range of embedded applications.” 

The new G-Series’ balanced set of peripheral support, performance options, and overall energy efficiency are expected to make an immediate impact with AMD customers and the embedded ecosystem.

 “The embedded market is an incredibly dynamic space right now, enabled by more immersive graphics and significant gains in power efficiency and performance,” said Shane Rau, IDC. “The advent of versatile system on chip (SoC) solutions that are pin-compatible across a range of performance and price, coupled with comprehensive embedded software stacks, are giving product engineers a much greater range of choices in building dynamic, graphically rich next gen systems.”

3rd Generation AMD Embedded G-Series SoC
The low-power AMD Embedded G-Series is designed to deliver an immersive, graphically rich experience and smooth system performance, all in a compact, energy efficient SoC with low power consumption and significant memory bandwidth for mainstream embedded applications. With impressive gains in compute and graphics performance compared to the prior generation embedded G-Series, the new additions to the lineup are ideal for thin clients, IP set-top boxes, and TVs, casino gaming, industrial control and automation, digital signage, and communications networks. The new models include “Excavator” x86 CPU cores and 3rd generation Graphics Core Next (GCN) graphics with support for OpenGL ES, OpenCL™, DirectX® 12, and EGL. For greater design flexibility, the new 3rd Generation Embedded G-Series SoCs, and the AMD Embedded R-Series SoC announced last fall are also all pin compatible.

3rd Generation AMD Embedded G-Series SoC Family key features and specifications:
  • Up to 2 “Excavator” x86 cores
  • AMD Radeon™ graphics (up to 4 GCN compute units1)
  •  4K x 2K H.265 decode (10-bit compatibility on select devices) & multi-format encode & decode
  • Multiple display technology - HDMITM 2.0, DP 1.2, eDP 1.4
  • 6~15W Thermal Design Power (TDP)
  • Up to 2 Channels DDR4/DDR3
  • Integrated AMD Secure Processor
  • 10-year planned longevity

Embedded G-Series LX Family SoC
The Embedded G-Series LX SoC is a new, low-power x86 SoC offering compelling performance for the price with advanced multimedia and display features. It features the “Jaguar” CPU core with support for Error Correcting Memory (ECC) and GCN, as well as support for DirectX® 11.2, OpenGL 4.3, and OpenCLTM 1.2. The Embedded G-Series LX SoC is ideally suited for numerous applications, including retail point-of-sale terminals, digital signage, arcade gaming, and industrial control. The AMD Embedded G-Series LX SoC uses the same FT3b socket as its predecessor codenamed “Steppe Eagle” and provides a higher-performance migration path for AMD Geode™ customers.

G-Series LX key features and specifications:
  • 2 “Jaguar” x86 cores
  • AMD Radeon™ Graphics Core Next (GCN) graphics
    • Multi-format encode & decode
    • Multiple display technology - HDMITM 2.0, DP 1.2, eDP 1.4
  • 6~15W TDP
  • Single-channel DDR3
  • AMD Secure Processor
  • Industrial temperature - extended temperature SKUs

The first 3rd Generation AMD Embedded G-Series SoCs are available immediately with additional offerings planned in the first and second quarter of this year. The first AMD Embedded G-Series LX products are expected to be available in March.

Supporting Resources
·       Learn more about the new AMD Embedded G-Series product family
·       AMD Embedded Processor product page
·       Follow @AMDEmbedded on Twitter
·       Become a fan of AMD on Facebook
·       Follow AMD on Twitter @AMD

Industry Support

“The new AMD Embedded G-Series SOCs boast vibrant, immersive graphics, high performance, and low power for robust yet fanless designs,” said Christian Eder, Marketing Director of Congatec. “We’re excited about the pin compatibility of the 3rd Generation G-Series
I-Family with the R-Series as this scalability makes it even easier to incorporate these processors into multiple COM Express designs.”

“Using the new, highly scalable AMD G-Series embedded processors, embedded developers can perform evaluation, prototyping, and development by downloading the freely available Mentor Embedded Linux Lite and Sourcery CodeBench Lite tools," said Scot Morrison, general manager, platform business unit, Mentor Graphics Embedded Systems Division. "The combination of the AMD Embedded processors and the Mentor Embedded Linux make for a powerful hardware/software platform solution to create dynamic, immersive applications with great multimedia capabilities targeting markets such as digital gaming, point-of-sale (POS), and electronic signage/displays.”

“As a leader in embedded virtualization and real-time hypervisor technology, RTS has been working closely with AMD hardware partners to bring robust embedded solutions to market for the industrial and medical ecosystems,” said Gerd Lammers, CEO of RTS. “With scalable SoC performance, the AMD G-Series processer family is an ideal fit for running real-time virtual applications.”

“Sapphire and AMD have long collaborated to bring innovative products to the embedded market,” said Adrian Thompson, VP of Marketing for SAPPHIRE Technology. “With software compatibility from the entry-level LX to higher performing processors, our board level solutions based on the newest AMD G-Series embedded processors will enable customers to incorporate these scalable products quickly and easily into their projects. This new generation brings hardware and software scalability, excellent performance and immersive graphics for immersive multimedia applications.”

About AMD
For more than 45 years AMD has driven innovation in high-performance computing, graphics, and visualization technologies ― the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses, and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work, and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) websiteblogFacebook and Twitter pages.

Tuesday, February 23, 2016

OPPO F1: The Selfie Expert

Global electronics and technology service provider OPPO locally has launched their first phone of the year, the OPPO F1.

Boasting an amazing front camera, the F1 has been dubbed the “Selfie Expert,” thanks to its mix of hardware and software working together to make every selfie fantastic. This was emphasized during the launch, with the event setup designed similar to that of a photography studio as guests were given free use of the F1.

Built-in Styling Team
At 8 megapixels, the OPPO F1’s front camera has an 84-degree-wide angle camera lens with f/2.0 aperture, and a ¼-inch sensor that allows 40 percent more light to enter the camera than an f/2.4 aperture lens.

It comes with Beauty 3.0+ and eight various filters, which brighten the skin and remove blemishes, and a display that can double as flash in low-light environments. Both the camera’s hardware and software work together as if the OPPO F1 has a built-in styling team that will glam the user up in no time.

The rear camera is equally amazing, with a 13-megapixel sensor, f/2.2 aperture lens, Pure Image 2.0+ features, and a number of customizations to fit the user’s photo needs.

Exquisite Design and Reliable Performance
The first in OPPO’s new camera-focused F series, the F1, was designed with the elegant aesthetic and quality that has become the brand’s staple.

Available in two colors, Gold and Rose Gold, the F1’s design offers durability and style. The fine and delicate smoothening of zircon and sand blasting create a back cover that has a velvet-like softness despite being made of metal. The 5-inch HD screen is protected by a 2.5D Corning Gorilla Glass coating and aluminum housing.

Under the hood is a power-packed octa-core Qualcomm Snapdragon 616 SoC with four cores at 1.7GHz and four cores at 1.2GHz, Adreno 204 GPU, and 3GB RAM that runs OPPO’s ColorOS 2.1 as smoothly as possible.

Below are the OPPO F1’s specifications:
Operating System: ColorOS2.1, based on Android 5.1
Processor: Qualcomm Snapdragon 616, Octa-core
GPU: Adreno 405
Storage: 16 GB (Expandable up to 128GB)
Battery Capacity: 2,500mAh
Screen Size: 5 inches
Display Type: IPS TFT
Resolution: HD (1280x720 pixels)
Rear Camera: 13-megapixel
Front Camera: 8-megapixel
SIM Card Type: Dual-SIM (micro-SIM card and nano-SIM card)

Priced at only P11,990, the F1 is available at OPPO concept stores and authorized dealers nationwide.

New Brand Endeavors for 2016
Besides the F1, OPPO Philippines also announced major partnerships with several organizations.

This year, the company is the title sponsor of the PBA Commissioner’s Cup. The partnership is good for the entire season from February to May. The strategic tie-up is aimed at boosting OPPO’s local presence and building stronger affinity with the local basketball community, which will be achieved through a mix of on-ground and on-screen media values. This would include advertisements, merchandise, product placements, online and offline engagement, and OPPO’s very own branded segment. 

Locally, OPPO Philippines has been tapping the basketball community, and after a successful partnership with the FIBA 2014, the electronics giant have once again made another big splash as they have been named as the title sponsor of the PBA Commissioner’s Cup. This year’s tournament will then be called as the OPPO PBA Commissioner’s Cup. 

After collaborating with Home Credit last year to bring the OPPO Neo 7 to more consumers in the country, OPPO has also once again partnered with the global consumer-finance provider to offer Filipinos more options to buy the F1. From February 19 to March 31, 2016, even consumers who don’t have credit cards can purchase the new camera phone for as low as P1,299 every month for six months at 0 percent interest rate. The promo is available in 245 partner stores nationwide, in all areas serviced by Home Credit.

OPPO is likewise proud to announce that their phones will now be offered by Philippine telcos.

For example, the F1 will be available under Smart Communications’ All-in Plan 1200. The postpaid plan is fully consumable and customizable with FlexiBundles. For prepaid users, each purchased F1unit comes with a free Smart SIM that offers a generous 50MB worth of free data every month for six months, and P150 worth of load for every P250 accumulated top up per month for six months.

The OPPO Neo 5s will also be available under Sun Cellular’s Best Value Plan 450, which includes unlimited Sun calls and texts, 250MB of data, and 250 texts to other networks.

Monday, February 15, 2016

Hitachi hosted Social Innovation Forum in Philippines

Mr. Hiroaki Nakanishi, Chairman & CEO of Hitachi, and Mr. Mitsuhiko Shimizu, General Manager of Hitachi Asia Ltd. Philippine Branch, at the press conference before the start of the Hitachi Social Innovation Forum. 
The future is looking brighter for the Philippines as one of the most respected tech and innovation brands in the world sets it sight for significant game-changing projects for the country for years to come.

Hitachi Asia Ltd., a subsidiary of Hitachi, Ltd. hosted “Hitachi Social Innovation Forum in Philippines” at New World Makati Hotel last February 12, 2016 and discussed the need for sustainable solutions to address the challenges facing the Philippines and the region.

Mr. Arnel Paciano Casanova, President and Chief Executive Officer of the Philippines Bases Conversion and Development Authority (BCDA), graced  the event as guest-of-honor.

Casanova welcomes the offer of Hitachi in developing the future green city and added that BCDA is about to sign a joint venture agreement with the Japan Overseas Infrastructure Corporation to boost Japanese investments in the country, including at the Clark Green City, scheduled to be launched in March this year.

"When you build a city, you need power, water...telecommunications also, fiber optics, because we want the city to be an intelligent city, and adopting the internet of things," Casanova emphasized.

Through hosted exhibition and business seminars, the forum showcased a broad range of solutions in Hitachi’s “Social Innovation Business”, which combines infrastructure and advanced information technologies. Customers, business partners, and major stakeholders in the Philippines were able to have a better understanding of Hitachi’s key business fields such as information and telecommunication systems, power systems, healthcare, and transportation.

The Social Innovation Forum also provided an opportunity to discuss technological answers to various societal issues particularly in the Philippines. The keynote speech by Mr. Hiroaki Nakanishi, Chairman & CEO of Hitachi explored global mega trends that require Social Innovation and how Hitachi’s expertise can drive these opportunities.

Nakanishi was glad to confirm that the company’s business size in the country is “growing very rapidly” with 2015 revenues hitting “very close” to $300 million, which was 1.5 times what it was two years ago.

He also shared that one of the objectives of his visit to the country is to instruct his people here to “make a very clear growth plan” for local expansion. He also wants to understand more deeply the issues to be solved in the Philippines.

Delegates had a relevant learning journey from Hitachi speakers Mr. Mitsuhiko Shimizu, General Manager of Hitachi Asia Ltd. Philippine Branch; Mr. Alistair Dormer, Global CEO of Hitachi - Rail and Chairman of Hitachi Rail Europe; and Mr. Alireza Aram, Senior Vice President of Energy Solutions Company. They shared their views on the Philippines’ market growth and upcoming challenges, and introduce some of Hitachi’s solutions to meet the market needs of urbanization from the view of Energy Management, Urban City Development, and Public Transportation supported by Information Communication Technologies.

This is the third Hitachi Social Innovation Forum to be held in Southeast Asia (SEA), following successful events in Singapore in 2014 and Myanmar in 2015. Hitachi is placing increasing emphasis on SEA as it aims to increase its overseas sales ratio from 45% in FY2013 to over 50% in FY2015 under its “2015 Mid-term Management Plan”. Asia is one of the most important markets for the Hitachi Group, and the Company is aiming to increase its revenue in Asia (excluding China) from 989.9 billion yen in FY 2013 to 1,100.0 billion yen in FY2015. To further expand its Social Innovation Business in this region, Hitachi is planning a series of upcoming Social Innovation Forums in other SEA countries in FY2016.

Mr Ichiro Iino, Chief Executive for Asia Pacific, Hitachi, Ltd. said, "Throughout our long history in Asia, Hitachi has been working closely with various countries to support the region's long-term development. For the Philippines, this began 86 years ago when we supplied hydro turbines to Davao. We are very excited to see the country's rapid economic growth particularly in recent years, driven by strong government support. Through the Social Hitachi Innovation Forum held in the Philippines, we hope to showcase some successful examples of Hitachi's Social Innovation Business and how these can contribute to the Philippines and this region.”

Hitachi aspires to drive innovation together with all of its stakeholders in ways that make positive contributions to society and seeks to inspire a world that provides safety, comfort and convenience to people throughout the planet, as well as for future generations.

For more information on Hitachi Asia, please visit the company's website at